Workpiece example of bonding flexible printed circuit boards (FPC) for semiconductors
Photo 2. Bonding work(provided by Elephantech Inc.)
Flexible printed circuit boards are thin, flexible, maintain their electrical properties even when deformed, and are used as bonding cables to connect substrates and various electronic precision equipment, such as mobile terminals, PCs, cameras, and other digital equipment that require thin and light circuit boards.
The thin and flexible structure of flexible printed circuit boards can cause the adhesive layer on the bonding surface to come off and cause poor bonding when the adhesive layer and conductor foil are solder bonded over a thin film of insulation. This can cause defects like deformation when bonding with high temperatures such as in wire bonding.
For ultrasonic bonding using our complex vibration technology, the vibration trajectory is not folded back which makes it very efficient in eliminating oxide layers at bonding interfaces and promotes metal bonding through plastic flow.
Additionally, having no folded back vibration trajectories makes it is suitable for bonding fine parts as it allows for low-energy, non-intrusive bonding.