LINK-US Co., Ltd.


Ellinker-20kHz logo

High-frequency model with reduced amplitude for delicate workpieces which easily crack.

Ellinker 20kHzの製品画像 Download specifications

Device Features



High-frequency amplitude bonding made possible

By being able to reduce vibration amplitude through high frequency, the Ellinker-40kHz can be used for electronic device parts, semiconductor parts, and other parts that require more delicate bonds.



Compact body for easy installation

A bonder that is compact both in size and weight. It can be installed in small spaces and it takes minimal time to assemble when incorporating it into your production line.

Example of Bonds

Bonding a glass epoxy board with a copper wire (0.195 sq.)

Even when working with wires that have thin wire diameters and boards that easily crack, you can make quality bonds. Suitable for bonding power devices such as sensors and connectors for precision equipment, as well as for power and semiconductor devices for electricity.

Workpiece information

  • Glass epoxy board: Treated with flash gold plating
  • Copper wire: 0.195 sq.

Equipment Specifications

Equipment Dimensions/Weight
Drive part
Approx. W280 mm x D500 mm x H751 mm / Approx. 45 kg
Control panel
Approx. W650 mm x D500 mm x H400 mm / Approx. 70 kg
Approx. W370 mm x D450 mm x H200 mm / Approx. 30 kg
Touch panel
Screen size - 8.4 inches
Bonding Specifications
Bonding area
Approx. 78.5 mm² (depending on the workpiece specified by your company)
Drive system
AC servo motor (1 kW)
Control method
Position control, speed control, and push control via AC servo motor (set range: 1 to 400 N)
Target workpieces
Workpieces designated by your company (next-generation battery parts (all solid state, LIB, etc.), power semiconductor parts, etc.)
Maximum stroke
Distance from horn standby position to maximum bond depth: 40 mm (50 mm for maintenance)

* Due to product improvements, specifications and appearance are subject to change without notice.
Please note that since our products are made to order, the specifications may differ from those listed, depending on the required specifications and options.

For more detailed specifications, including information about appearance size, please refer to the following specifications:

Download specifications

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