High-frequency model with reduced amplitude for delicate workpieces which easily crack.Download specifications
By being able to reduce vibration amplitude through high frequency, the Ellinker-40kHz can be used for electronic device parts, semiconductor parts, and other parts that require more delicate bonds.
A bonder that is compact both in size and weight. It can be installed in small spaces and it takes minimal time to assemble when incorporating it into your production line.
Even when working with wires that have thin wire diameters and boards that easily crack, you can make quality bonds. Suitable for bonding power devices such as sensors and connectors for precision equipment, as well as for power and semiconductor devices for electricity.
* Due to product improvements, specifications and appearance are subject to change without notice.
Please note that since our products are made to order, the specifications may differ from those listed, depending on the required specifications and options.
For more detailed specifications, including information about appearance size, please refer to the following specifications:Download specifications
Our flagship model which can be used for large area bonding
Our Standard Model That Can Handle a Wide Range of Workpieces From Large to Small
High-frequency model equipped with both a camera that automatically recognizes workpieces and an automatic XY table.