The 39th Symposium on Fundamentals and Applications of Ultrasonic Electronics Dates: October 29(Mon.)-31(Wed.), 2011 Venue: Doshisha University, Imadegawa Campus, Muromachi Campus, Kanmeikan Presenter: Jiromaru Tsujino Presentation time: October 30 (Tue.), 10:15 a.m.- Presentation details: "2E2-4" [Ultrasonic complex vibration welding using a diagonal slit complex vibration transducer with single wavelength longitudinal vibration mode Ultrasonic composite vibration welding using oblique slit composite vibration transducers】 The inventor of "Ultrasonic composite vibration technology" and Chairman of the Board of Directors of our company. Thank you very much for coming and listening to the presentation by Dr. Tsujino, the inventor of "Ultrasonic Combined Vibration Technology" and Chairman of the Board of Directors of our company.