Sixth Adhesion and Bonding Expo

Session: May 11th 2022 (Wed.) to May 13th (Fri.)

Venue: INTEX Osaka 

We had a joint exhibition at the CHIYODA TRADING CORPORATION booth (Booth number: 14-17)

We would like to express our gratitude for your attendance.

(Demonstration using an ultrasonic complex vibration bonder)