LINK-US Lab～Part5
Research and Development at the Korea Lab: Close Look at the Frontiers of Ultrasonic bonding
This is the 5th parts of LINK-US Lab! LINK-US is leading the evolution of ultrasound technology, and the LINK-US Labs located in Japan and Korea are at the heart of its research and development. This time, we would like to introduce the LINK-US Lab located in Busan.
In this part, we will sneak into this lab and introduce the forefront of research and development making full use of the world's only ultrasonic complex vibration bonding equipment!
What is the ultrasonic complex vibration bonding technology attracted attention by world?
The world's only ultrasonic complex vibration bonding system developed in the LINK-US Lab. By linear and torsional vibrations, it enabled bonding of dissimilar materials and complex shapes, which were impossible with conventional ultrasonic bonding.
Furthermore, by achieving bonding with extremely reduced impurities, it enables high-strength, high-quality bonding, which is attracting attention in a variety of fields. LINK-US' Korean lab has installed two of these devices and is currently conducting development and research.
Click here for more information about ultrasonic bonding by LINK-US.
Solve your bonding issues!
The shape of the material is complicated and difficult to bond...“
”I want to bond dissimilar materials but can't find a suitable method..."
If your company has such problems, please contact us at LINK-US Lab!
Our expert staff, who are well versed in ultrasonic technology, will listen to your issues and propose the best bonding method. The test bonding using the world's only ultrasonic complex vibration bonding equipment will allow you to feel the effect of the bonding method.
Examples of bonding issues that LINK-US Lab can solve
- Bonding of parts with complex geometries
- Bonding heat-sensitive materials
- Bonding dissimilar materials
- Bonding of fine parts
- High-strength, high-quality bonding
Japanese and Korean experts collaborate!
LINK-US Lab has established a lab at BMS Engineering in Korea in addition to its lab in Japan and has built a research and development system that takes advantage of the expertise of each lab.
Japan Lab: Ultrasonic experts in charge of a wide range of ultrasonic complex vibration technology from basic research to application development, expanding the further possibilities of ultrasonic technology beyond bonding.
Korea Lab: The only ultrasonic complex vibration bonding test lab outside of Japan, with experience in bond research with universities, and with extensive research on ultrasonic technology, providing support for LINK-US.
By Japanese and Korean experts establishing a thorough support system for bonding issues, we develop more advanced technologies and meet the diverse needs of our customers.
Corresponding field
LINK-US supports a wide variety of manufacturing customers.
- Lithium-ion batteries: bonding battery cells, bonding tabs, etc.
- Semiconductor back-end: packaging, wire bonding, etc.
- Automotive manufacturing: bonding body parts, interior parts, etc.
- Other various manufacturing industries
Please contact us first!
Please contact LINK-US's team of experts for your ultrasonic bonding needs.
We will provide you with the best solution to solve your problem.
LINK-US Lab will continue to lead the evolution of ultrasonic bonding technology and contribute to society.