The 23rd IC and Sensor Packaging Technology Expo

Session: January 19th 2022 (Wed.) to January 21st (Fri.)

Venue: Tokyo Big Sight East Hall 3

Booth number: 24-53

This is planned to be a joint exhibit held at the booth of MORITANI & Co.,Ltd. We would like to thank you in advance for attending.

(Demonstration using an ultrasonic complex vibration bonder)