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Challenge to Difficult-to-Bond Materials: Single-Pass Multi-Point Bonding for Coated Metals — Zero Deformation, Guaranteed Mass Production

  • Heat exchanger
  • Difficult bonding
  • AI Data Center
  • Electronic components
  • Semiconductor

As noted in our previous article, "Breaking the Polymer C...
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Challenge to Difficult-to-Bond Materials: A New Standard for Low-Heat, Low-Energy Bonding That Preserves the Resin Layer in Composite Substrates

  • Difficult bonding
  • AI Data Center
  • EV
  • Electronic components
  • Semiconductor
  • Heat exchanger
  • Lithium-ion battery

Continuing our discussion on polymers, this time we focus...

Challenge to Difficult-to-Bond Materials: Breaking the Polymer Coat Barrier — Achieving High-Quality Bonding by Displacing the Polymer Layer

  • Difficult bonding
  • AI Data Center
  • EV
  • Electronic components
  • Semiconductor
  • Heat exchanger
  • Lithium-ion battery

Many metal components are coated with metal or resin for ...

Challenge to Difficult-to-Bond Materials: Breaking the Tin Plating Barrier — Bonding While Leveraging the Plating Layer

  • EV
  • Electronic components
  • Semiconductor
  • Lithium-ion battery
  • Difficult bonding

Tin (Sn) plating is widely used in electronic components,...

The EV Battery Revolution: Enhanced Reliability through Low-Heat Cu–Al Bonding

  • EV
  • Electronic components
  • Cylindrical can
  • Semiconductor
  • Bev
  • Lithium-ion battery
  • Difficult bonding

As Electric Vehicles (EVs) rapidly gain global adoption, ...

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Trouble with Bonding or Design? Solved by Ultrasonic Complex Vibration.