LINK-US Co., Ltd.

BLOG

Challenge to Difficult-to-Bond Materials: Single-Pass Multi-Point Bonding for Coated Metals — Zero Deformation, Guaranteed Mass Production

  • Semiconductor
  • Heat exchanger
  • Difficult bonding
  • AI Data Center
  • Electronic components

As noted in our previous article, "Breaking the Polymer C...

Challenge to Difficult-to-Bond Materials: A New Standard for Low-Heat, Low-Energy Bonding That Preserves the Resin Layer in Composite Substrates

  • Heat exchanger
  • Lithium-ion battery
  • Difficult bonding
  • AI Data Center
  • EV
  • Electronic components
  • Semiconductor

Continuing our discussion on polymers, this time we focus...

Challenge to Difficult-to-Bond Materials: Breaking the Polymer Coat Barrier — Achieving High-Quality Bonding by Displacing the Polymer Layer

  • Heat exchanger
  • Lithium-ion battery
  • Difficult bonding
  • AI Data Center
  • EV
  • Electronic components
  • Semiconductor

Many metal components are coated with metal or resin for ...

Challenge to Difficult-to-Bond Materials: Breaking the Tin Plating Barrier — Bonding While Leveraging the Plating Layer

  • Lithium-ion battery
  • Difficult bonding
  • EV
  • Electronic components
  • Semiconductor

Tin (Sn) plating is widely used in electronic components,...

The EV Battery Revolution: Enhanced Reliability through Low-Heat Cu–Al Bonding

  • Difficult bonding
  • EV
  • Electronic components
  • Cylindrical can
  • Semiconductor
  • Bev
  • Lithium-ion battery

As Electric Vehicles (EVs) rapidly gain global adoption, ...

Solved by Ultrasonic Specialists.

Trouble with Bonding or Design? Solved by Ultrasonic Complex Vibration.