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Challenge to Difficult-to-Bond Materials: Single-Pass Multi-Point Bonding for Coated Metals — Zero Deformation, Guaranteed Mass Production

  • Electronic components
  • Heat exchanger
  • Semiconductor
  • AI Data Center
  • Difficult bonding

As noted in our previous article, "Breaking the Polymer C...
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Challenge to Difficult-to-Bond Materials: A New Standard for Low-Heat, Low-Energy Bonding That Preserves the Resin Layer in Composite Substrates

  • EV
  • Heat exchanger
  • Semiconductor
  • AI Data Center
  • Difficult bonding
  • Electronic components
  • Lithium-ion battery

Continuing our discussion on polymers, this time we focus...

Challenge to Difficult-to-Bond Materials: Breaking the Polymer Coat Barrier — Achieving High-Quality Bonding by Displacing the Polymer Layer

  • EV
  • Heat exchanger
  • Semiconductor
  • AI Data Center
  • Difficult bonding
  • Electronic components
  • Lithium-ion battery

Many metal components are coated with metal or resin for ...

Solved by Ultrasonic Specialists.

Trouble with Bonding or Design? Solved by Ultrasonic Complex Vibration.