The company raised 620 million yen in a Series C extension round, bringing its total funding to 4.3 billion yen
LINK-US Raises 620 Million Yen in Series C Extension Round, Bringing Total Funding to 4.3 Billion Yen
— Accelerating R&D of Microbonding for High-Frequency Devices and Expanding Globally to Cutting-Edge Markets —
LINK-US Co., Ltd. (Headquarters: Yokohama, Kanagawa; Representative Director: Jun Mitsuyuki; hereinafter "the Company"), a developer, manufacturer, and distributor of metal bonding equipment using ultrasonic complex vibration bonding, is pleased to announce that it has raised a total of 620 million yen in a Series C Extension Round. With this, the Company's cumulative funding has reached approximately 4.3 billion yen.
Background and Purpose of Funding
The Company has been providing advanced bonding solutions—previously difficult with conventional technologies—in the electric vehicle (EV), battery, and electronic device sectors, utilizing its world's exclusive "ultrasonic complex vibration technology" as its core.
With this latest funding, we will strengthen the development of next-generation "high-frequency band" equipment that enables even finer bonding. As semiconductors and precision electronic components continue to evolve, the global demand for microscopic and highly accurate bonding is increasing. The Company will invest these funds to accelerate its expansion not only in domestic manufacturing sites but also into overseas markets requiring advanced technologies, thereby contributing to the evolution of the global manufacturing infrastructure.
Investors in this Round (in no particular order)