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LINK-US Lab~Part4 LINK-US Solution Our team of ultrasonic bonding experts will evolve your plant!

LINK-US Lab~Part4 LINK-US Solution Our team of ultrasonic bonding experts will evolve your plant!

2025.9.19 LINK-US Lab

 

 

LINK-US Lab~Part4

Our team of ultrasonic bonding experts will evolve your plant!

This is the 4th parts of LINK-US Lab! In this part, we will focus on solving ultrasonic bonding issues in the manufacturing industry.


Experts on ultrasonic waves and joining technology provide full support for problem solving.

 

In manufacturing, you face a variety of challenges every day, don't you?

"Yield rate is not increasing...“

”Product quality is not stable...“

”Maintenance costs are too high..."

For you who have above troubles! Ultrasonic bonding may be your solution.

What is ultrasonic bonding?

Ultrasonic bonding is a technology for bonding materials by irradiating sound waves (ultrasonic waves) with a frequency of 20 kHz or higher onto the materials and using the vibration energy.

It has been attracting attention in various fields in recent years because of its features such as low thermal effect, possibility of bonding dissimilar materials, high speed and high efficiency.

Click here for more information on LINK-US ultrasonic bonding.

Why consult with LINK-US?

LINK-US has many experts in both ultrasonics and bonding technology.


Understanding issues   Solution proposal    accompaniment support

 

LINK-US's team of experts, with a wealth of knowledge and experience cultivated through years of research and development, as well as advanced analytical capabilities, will thoroughly analyze your issues and propose the optimal solution.

LINK-US not only analyzes the issues, but also provides a full range of support from the introduction of the equipment to the manufacture of the product, including accompaniment support, so you can consider the introduction of the equipment with confidence.

Examples of specific solutions

LINK-US Lab offers the best solutions to the various challenges faced by our customers.

  1. technical issues

LINK-US's ultrasonic welding equipment with compound vibration enables bonding of materials that have been difficult to bond in the past.

In addition, LINK-US can approach product development and technological development that have been postponed due to restrictions on processing conditions.

Please contact us if you have any of the following issues.

  • - For those who have trouble by insufficient joint strength
  • - For those who have trouble with poor joining of dissimilar materials
  • - For those who have trouble with joining fine parts
  • - For those who have other technical problems related to joining.

LINK-US experts will conduct bonding tests and support you in selecting the best bonding conditions and equipment.

  1. manufacturing process issues

Our experts will also estimate the effects that can be obtained by introducing LINK-US's compound vibration ultrasonic bonding equipment.

We will interview you about the production status of your final products and provide you with quantitative figures to show you how the introduction of the ultrasonic bonding machine will improve productivity and other aspects.

  • Yield is declining
  • Many defects in final products
  • Maintenance man-hours are increasing
  • Downtime is increasing
  • Other issues in the manufacturing process

LINK-US experts can support you building an efficient and stable production system by process analysis and proposing improvements.

Supported Fields

LINK-US supports a wide variety of manufacturing customers.

  • Lithium-ion batteries: battery cell bonding, tab bonding, etc.
  • Semiconductor back-end processing: packaging, wire bonding, etc.
  • Automotive manufacturing: Bonding of body parts, bonding of interior parts, etc.
  • Various other manufacturing industries

Please contact us first!

Contact LINK-US's team of experts for your ultrasonic bonding needs.

We will provide you with the best solution to solve your problem.

Contact us

LINK-US will continue to lead the evolution of ultrasonic bonding technology and contribute to society.

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