LINK-US Co., Ltd.

NEWS

news

2026.3.18 Media
The company raised 620 million yen in a Series C extension round, bringing its total funding to 4.3 billion yen
2026.3.2 Exhibitions
March 17th (Tue) - 19th (Thu) 2026 Exhibiting at the 20th Rechargeable Battery Expo
2026.2.9 Exhibitions
Announcement of Kumamoto Semiconductor Venture Pitch 2025-2026
2026.2.3 Exhibitions
Announcement of participation in MACNICA EXPONENTIAL TECHNOLOGY 2026 (MET2026)
2026.1.27 Exhibitions
We will be exhibiting at TechGala 2026, which will be held on January 27th and 28th.
2026.1.19 Exhibitions
Exhibiting at the MUFG Startup Summit in Kyoto
2025.12.22 Notices
Notice of New Year's holiday closure
2025.11.10 Exhibitions
Exhibiting at the 9th Adhesion & Bonding Expo from November 12th (Wednesday) to 14th (Friday), 2025
2025.10.17 LINK-US Lab
LINK-US Lab~Part6  Innovative bonding Technology ~ Achieve an improvement of the performance of lithium-ion batteries!?
2025.10.3 LINK-US Lab
LINK-US Lab~Part5 Undercover report! Research and Development at the Korea Lab: Close Look at the Frontiers of Ultrasonic bonding
2025.10.1 Media
[LINK-US] Featured on BS10 Startup World Cup Special Program
2025.9.19 LINK-US Lab
LINK-US Lab~Part4 LINK-US Solution Our team of ultrasonic bonding experts will evolve your plant!